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SF6: A new generation photoresist etchant

1. Chemical properties of sulfur hexafluoride


Sulfur hexafluoride is a colorless gas with a pungent odor. Its chemical style is SF6 and its molecular weight is 146.06 g/mol. Sulfur hexafluoride is non-flammable and does not support combustion, but reacts with reducing agents at high temperatures to produce toxic fluoride gas.



2. Etching mechanism of sulfur hexafluoride


Sulfur hexafluoride can be used as an etching agent, mainly because of its high chemical inertia and strong oxidation power at atmospheric pressure. In the etching process, sulfur hexafluoride will fluoridate the polymer chain in the photoresist, so that its molecular chain will gradually break, resulting in the etching effect.



3. Scope of application of sulfur hexafluoride


Sulfur hexafluoride is mainly used for photoresist etching of silicon-based semiconductor devices or integrated circuits in microelectronics, optoelectronics, TV panels and other fields. In some important production processes, sulfur hexafluoride has better etching effect than traditional etching agents such as oxygen.



4. Precautions


Because sulfur hexafluoride is highly oxidizing, it needs to be operated in special etching equipment, while ensuring that it does not come into contact with water vapor or air in the air, so as not to cause unnecessary chemical reactions. At the same time, the operator should also take necessary safety protection measures to avoid harm to the human body. To sum up, sulfur hexafluoride is a commonly used photoresist etch agent with high etching effect and wide application range. In order to ensure the success rate and quality of the production of the equipment, in the process of use, attention should be paid to safety protection measures to ensure the normal operation process.


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